工艺能力
|
项目
|
|
正常能力
|
先进能力
|
|
内层芯板厚度
|
Min
|
0.1mm
|
0.1mm
|
|
Max
|
2.0mm
|
3.0mm
|
|
线宽线距
|
Inner(1/3 or HOZ)
|
4/3 mil +/- 20%
|
2/2 mil +/- 10%
|
|
Outer(1/3 or HOZ)
|
4/4 mil +/- 20%
|
2/2 mil +/- 10%
|
|
阻抗控制
|
---
|
+/- 10%
|
+/- 5%
|
|
铜厚
|
Max
|
3/3 Oz
|
4/4 Oz
|
|
完成板厚
|
Max
|
3.2mm
|
3.5mm
|
|
完成板厚公差
|
>2.0mm and <3.0mm
|
+/- 0.18mm
|
+/- 8%
|
|
>1.0mm and <=2.0mm
|
+/- 0.13mm
|
+/- 8%
|
|
<=1.0mm
|
+/- 0.10mm
|
+/- 0.05mm
|
|
层数
|
Max
|
8 layers
|
14 layers
|
|
孔到铜间隙
|
4 layers
|
7 mil
|
6 mil
|
|
6 layers
|
8 mil
|
6.5 mil
|
|
8 layers
|
8 mil
|
7 mil
|
|
小孔径
|
Min drill bit
|
6 mil
|
4 mil
|
|
纵横比
|
Max
|
8:1
|
10:1
|
|
字符宽度
|
---
|
5 mil
|
4 mil
|
|
V-cut余厚
|
---
|
+/- 6 mil
|
+/- 4 mil
|
|
绿油
|
Line to pad
|
3 mil
|
2 mil
|
|
Solder bridge
|
4 mil
|
3 mil
|
|
Solder bridge(black ink)
|
5 mil
|
4 mil
|
|
Registration
|
2.5 mil
|
1.5 mil
|
|
插件孔
|
Size
|
+/- 3 mil
|
+/- 2 mil
|
|
压配孔
|
Size
|
+/- 2 mil
|
+/- 2 mil
|
|
孔位公差
|
Positional
|
+/- 3 mil
|
+/- 2 mil
|
|
非电镀 孔完成公差
|
Size
|
+/- 2 mil
|
+2/-0 or +0/-2 mil
|
|
外形公差
|
---
|
+/- 5 mil
|
+/- 4 mil
|
|
HDI
|
|
|
|
|
板厚
|
Min
|
0.4 mm
|
0.35 mm
|
|
Max
|
2.4 mm
|
4.0 mm
|
|
盲孔类型
|
---
|
2+N+2, BVH
|
3+N+3, BVH
|
|
树脂塞孔小孔径
|
Min
|
0.15 mm
|
0.07 mm
|
|
Max
|
0.8 mm
|
1.5 mm
|
|
孔铜回填小孔径
|
Min
|
0.07 mm
|
0.07 mm
|
|
Max
|
0.5 mm
|
0.5 mm
|
|
镭射钻孔大小
|
---
|
0.07 mm
|
0.15 mm
|
您现在的位置：
