| Items | Normal capability | Advance capability | |
| Inner core thickness | Min | 0.1mm | 0.1mm |
| Max | 2.0mm | 3.0mm | |
| Conductor width and spacing | Inner(1/3 or HOZ) | 4/3 mil +/- 20% | 2/2 mil +/- 10% |
| Outer(1/3 or HOZ) | 4/4 mil +/- 20% | 2/2 mil +/- 10% | |
| Impedance control | --- | +/- 10% | +/- 5% |
| Copper thickness | Max | 3/3 Oz | 4/4 Oz |
| Board thickness | Max | 3.2mm | 3.5mm |
| Board thickness tolerance | >2.0mm and <3.0mm | +/- 0.18mm | +/- 8% |
| >1.0mm and <=2.0mm | +/- 0.13mm | +/- 8% | |
| <=1.0mm | +/- 0.10mm | +/- 0.05mm | |
| Layer count | Max | 8 layers | 14 layers |
| Hole to copper spacing | 4 layers | 7 mil | 6 mil |
| 6 layers | 8 mil | 6.5 mil | |
| 8 layers | 8 mil | 7 mil | |
| Finished Hole size | Min drill bit | 6 mil | 4 mil |
| Aspect ratio | Max | 8:1 | 10:1 |
| Legend mark width | --- | 5 mil | 4 mil |
| V-cut remain thickness | --- | +/- 6 mil | +/- 4 mil |
| Solder mask | Line to pad | 3 mil | 2 mil |
| Solder bridge | 4 mil | 3 mil | |
| Solder bridge(black ink) | 5 mil | 4 mil | |
| Registration | 2.5 mil | 1.5 mil | |
| Insertion hole | Size | +/- 3 mil | +/- 2 mil |
| Press fit hole | Size | +/- 2 mil | +/- 2 mil |
| Hole Positional tolerance | Positional | +/- 3 mil | +/- 2 mil |
| NPTH hole | Size | +/- 2 mil | +2/-0 or +0/-2 mil |
| Profiling tolerance | --- | +/- 5 mil | +/- 4 mil |
| HDI | |||
| Board Thicknes | Min | 0.4 mm | 0.35 mm |
| Max | 2.4 mm | 4.0 mm | |
| Blind Vias Tpyes | --- | 2+N+2, BVH | 3+N+3, BVH |
| Holes size for Resin Plugged holes | Min | 0.15 mm | 0.07 mm |
| Max | 0.8 mm | 1.5 mm | |
| Holes size for Copper filling | Min | 0.07 mm | 0.07 mm |
| Max | 0.5 mm | 0.5 mm | |
| Laser drill size | --- | 0.07 mm | 0.15 mm |
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